Abstract
This document is for software and system engineers who are building and customizing images, kernels, and native SDKs for the Intel® Edison Development Platform. Pre-compiled versions of the Board Support Package (BSP) are available on the Intel® Edison Downloads page. Users who don’t want to modify the default images don’t need to read this document.
The Intel® Edison Board Support Package offers these features:
- Kernel image based on Linux kernel 3.10.17
- U-boot second stage bootloader
- Bluetooth and Wi-Fi connectivity
- Intel cloud connectivity middleware
- Many base Linux packages provided by the Yocto project
The complete document is in a PDF.
http://download.intel.com/support/edison/sb/edisonbsp_ug_331188005.pdf